Materials Mechanics
Monocular 3D Video Extensometer
Highly accelerated life testing evaluates the performance and durability of PCB boards under extreme environmental conditions within a short time. Such tests typically involve harsh conditions such as rapidly changing thermal cycles, mechanical shock, and vibration. Through this testing, design flaws and potential failure points of the circuit board can be identified in advance, allowing design optimization and improved product reliability.
The Haytham monocular 3D high-speed visual strain gauge adopts monocular 3D DIC technology combined with high-speed cameras and advanced image processing algorithms to measure full-field strain and displacement of PCB boards in dynamic environments. The instrument not only captures minute deformation during high-speed vibration and shock but also analyzes the strain field in detail through high-frequency data acquisition.

During the test, the PCB was placed in highly accelerated life test equipment and subjected to a variety of simulated extreme environments. The Haytham monocular 3D high-speed visual strain gauge monitored the strain and displacement on the board surface in real time through a single high-speed camera. Particularly during sudden temperature changes, mechanical vibration, and at the instant of shock, the instrument captured the strain distribution and displacement changes on the PCB, providing comprehensive stress-strain data.

The strain and displacement data acquired during the test help engineers understand the mechanical performance of the circuit board under extreme environments. In-depth analysis of these data identifies weak regions on the board and reveals their fatigue behavior under extreme conditions, guiding product improvements.