Materials Mechanics
Monocular 3D Video Extensometer
Monocular 2D Optical Strain Measurement System
Monocular 3D Optical Strain Measurement System
High-Speed Monocular 3D Optical Strain Measurement System
Stereo 3D Optical Strain Measurement System
Optical Strain Measurement System – Educational Edition
2D Optical Microscopic Strain Measurement System
Strain Measurement of Parallel Lap Welds
Residual Deformation Measurement of Drilled Welded Plates
Full-Field Strain Measurement of Weldments in Compression
Tensile Deformation Measurement of 0.3mm Fiber Filament
Unmarked Compression Deformation Measurement of Composite Materials
Deformation Measurement of Artificial Cardiac Patch
Keycap Vibration Measurement: Quantifying Press and Rebound Dynamics
Headband Deformation Measurement: Analyzing Bending Position and Unloading Recovery
High-Temperature DIC Measurement of Wafer Thermal Warpage: Quantifying Warpage vs. Temperature
UAV Dynamic Tracking Measurement: Capturing Flight Trajectory and Attitude Changes
0755-86347753

In some field testing tasks, the focus is often on the displacement results at key locations, while high demands are also placed on the stability of the measurement process and the consistency of the results. Especially in field environments with complex conditions and limited measurement conditions, a single device usually needs to balance both measurement coverage and result accuracy, which poses higher challenges for test implementation and data acquisition.

For such scenarios, Haytham supports dual-device collaborative measurement. Two DIC devices can simultaneously track and acquire the same target point, obtaining displacement results while also providing a basis for cross-comparison and verification between data sets. For field testing, this collaborative approach offers more support for result verification and subsequent analysis.