High/Low Temperature Deformation Test of Phone Optical Sensor

In high/low-temperature deformation testing of mobile phone light sensors, the light sensor must withstand extreme temperature changes from 20°C down to -40°C and back up to 200°C. To ensure the performance stability of the light sensor under these temperature conditions, it is essential to accurately measure its minute deformation in different temperature environments. With its advanced digital image correlation (DIC) technology, the Haytham visual strain measurement system provides a reliable solution for this test.

Traditional contact measurement methods often suffer from insufficient accuracy and environmental interference when dealing with tiny components, especially at extreme temperatures. Contact sensors may introduce errors under drastic temperature changes and may even cause physical damage to sensitive components such as the light sensor. The Haytham visual strain measurement system, by contrast, adopts a non-contact measurement approach, using high-resolution image capture and precise strain calculation to successfully avoid these potential problems.

Specimen Dimensions and Test Setup

During the test, the surface deformation of the light sensor is captured in real time. The system precisely tracks the minute strain induced by temperature changes and outputs stress-strain curves instantly. This process not only provides high-precision deformation data but also visually presents the strain distribution of the light sensor under different temperature conditions through the generated visualization images. These data are of great significance for analyzing the thermal expansion and contraction of the light sensor and the resulting performance changes.

Through the application of this system, researchers can gain in-depth insight into the mechanical behavior of the light sensor in extreme temperature environments, providing a scientific basis for ensuring product reliability under various operating conditions. This efficient and precise testing process greatly advances research on the stability of light sensors at extreme temperatures and promotes the development and application of more reliable mobile phone optical components.