Microscopic DIC Full-Field Strain Measurement of Earphone Cable: Locating Fatigue Weak Points Under Repeated Bending

In actual use, earphone cables must withstand long-term bending, tension, and torsion, and fatigue damage is especially likely to occur at the plug root, the split point, and the cable connection areas. Because earphone cables have a small diameter and a limited range of local deformation, conventional measurement methods can hardly obtain their surface strain distribution accurately.

Haytham Visual Microscopic Strain Measurement SystemBy combining microscopic imaging with DIC digital image correlation technology, the minute displacements and full-field strain of earphone cables during loading are measured under non-contact conditions. During the test, the system continuously records surface images of the cable in bending or tension and calculates the strain changes in different regions through correlation algorithms.

Compared with merely observing whether the cable breaks, DIC microscopic measurement can identify strain concentration locations in advance, determine which region of the cable surface bears greater deformation, and track how the strain concentration develops with the number of bending cycles. Cables with similar appearance but different materials, braiding methods, or jacket structures can also be compared through the data.

Microscopic full-field strain measurement of earphone cables can be applied to the testing of earphone cables, charging cables, flexible wires, and miniature cables, providing a reference for cable structure optimization, fatigue life evaluation, failure location analysis, and quality verification.