Materials Mechanics
Monocular 3D Video Extensometer
Monocular 2D Optical Strain Measurement System
Monocular 3D Optical Strain Measurement System
High-Speed Monocular 3D Optical Strain Measurement System
Stereo 3D Optical Strain Measurement System
Optical Strain Measurement System – Educational Edition
2D Optical Microscopic Strain Measurement System
Strain Measurement of Parallel Lap Welds
Residual Deformation Measurement of Drilled Welded Plates
Full-Field Strain Measurement of Weldments in Compression
Tensile Deformation Measurement of 0.3mm Fiber Filament
Unmarked Compression Deformation Measurement of Composite Materials
Deformation Measurement of Artificial Cardiac Patch
Keycap Vibration Measurement: Quantifying Press and Rebound Dynamics
Headband Deformation Measurement: Analyzing Bending Position and Unloading Recovery
High-Temperature DIC Measurement of Wafer Thermal Warpage: Quantifying Warpage vs. Temperature
UAV Dynamic Tracking Measurement: Capturing Flight Trajectory and Attitude Changes
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Published: 2025-06-23
Haytham's single-camera 3D DIC technology is based on digital image correlation (DIC): a single camera captures images of the object surface, and the pixel changes between images are used to infer the 3D deformation of the object under load. Specifically, DIC applies a random pattern or markers on the object surface, analyzes images taken at different times using image comparison, and precisely computes the deformation of each point in 3D space.
Monocular 3D DIC Technology single-camera feature — performing 3D measurement with just one camera — makes testing simpler, reducing the complexity of using multiple cameras in traditional 3D DIC. Through advanced sub-pixel image processing algorithms, Haytham's single-camera 3D DIC achieves extremely high measurement accuracy, clearly capturing even tiny displacements and deformations.