Applications of DIC Technology in Thermal Testing

Thermal testing is usually used to evaluate the mechanical properties of materials under different temperature conditions, especially the deformation behavior in high- or low-temperature environments. Traditional thermal testing relies on contact sensors such as thermocouples and strain gauges to measure the temperature and strain of materials. However, these methods are often limited by the test environment and the acquisition of local data, and cannot provide full-field information on the material surface. Digital image correlation (DIC) makes up for these limitations through non-contact full-field measurement, becoming an important technical means in thermal testing.

In thermal tests under high- or low-temperature conditions, DIC can monitor the temperature gradient and deformation of the material surface in real time. By combining DIC with infrared thermal imaging, researchers can acquire the material's thermal distribution and surface deformation data simultaneously. This is crucial for thermal expansion, thermal stress analysis and thermal crack evaluation of materials at high temperature.

Full-field high-temperature 650°C tensile test of aircraft skin titanium alloy

For example, in the aerospace field,DIC technology is widely used in material testing in high-temperature environments. Key components such as aero-engine parts and turbine blades must withstand high-temperature loads; DIC provides accurate deformation data to help evaluate material deformation and fatigue behavior at high temperature. At low temperature, DIC can also be used to study superconducting materials and the mechanical properties of materials in liquid nitrogen environments, revealing the influence of low temperature on material deformation.

Another important application of DIC in thermal testing is crack monitoring. Thermal stress may cause cracks on the material surface; DIC can precisely measure the crack initiation position and propagation process, providing important data for material safety evaluation. Compared with traditional crack monitoring methods, DIC provides more detailed crack propagation paths and strain concentration areas, helping researchers deeply analyze crack causes and development trends.