Which Test Scenarios Suit the Haytham Single-Camera 3D DIC System?

Haytham single-camera 3D DIC system is a vision measurement system for material mechanics and structural deformation testing. Through monocular vision and DIC algorithms, it acquires 3D topography, displacement and strain data of the specimen surface, suitable for a variety of complex testing scenarios.

In conventional material testing,single-camera 3D DIC system can be used for tension, compression, bending and shear experiments of metal, plastic, rubber, composite and film specimens. The system outputs full-field displacement and full-field strain contour maps, helping users observe the overall deformation process of materials under load.

In high/low-temperature tests, the Haytham DIC system can be used together with high-temperature furnaces, low-temperature chambers and other equipment. With non-contact measurement, the device needs no direct contact with the specimen, suitable for experimental conditions with complex temperature environments and limited installation space.

In electronic device and precision structure testing, DIC systems can be used for deformation and vibration analysis of small structures such as PCB boards, chip packages, headphone headbands, laptop keycaps and UAV parts. For test objects that are small, light and low in stiffness, non-contact measurement avoids the influence of sensor mass and stiffness on results.

Compression measurement of metal specimens

In research verification,Haytham DIC system can also be used for simulation data comparison, structural optimization analysis and failure mechanism research. With full-field data, users can more intuitively judge the strain changes in different specimen areas and discover problems that traditional single-point measurement can hardly capture.

The Haytham single-camera 3D DIC system features intuitive measurement, flexible deployment and a wide application range; key calibration is completed before leaving the factory, helping users get into testing faster.